Paul K. Chu

Paul K. Chu (朱劍豪) is an internationally known specialist in plasma surface modification and materials science. He is Chair Professor of materials engineering at City University of Hong Kong.

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Biography

He received his BS in mathematics (cum laude) from The Ohio State University in 1977 and his MS and PhD in chemistry from Cornell University in 1979 and 1982, respectively.

He is a Fellow of the APS (American Physical Society, AVS(American Vacuum Society), IEEE,[1] and Hong Kong Institution of Engineers. He is the recipient of the 2007 IEEE NPSS Merit Award which is the most prestigious award given by IEEE in the areas of nuclear and plasma sciences and the 2008 MRS (Taiwan) JW Mayer Lectureship.

He is chairman of the International Plasma-Based Ion Implantation Executive Committee which organizes the biannual International Workshop on Plasma-Based Ion Implantation and Deposition (PBII&D) and a member of the Ion Implantation Technology (IIT) International Committee that organizes the biannual International Conference on Ion Implantation Technology as well as the IEEE Nuclear and Plasma Science Society Fellow Evaluation Committee.

He holds or has held advisory or visiting professorship in thirteen universities and research institutes in China, including the Institute of Microelectronics in Peking University, Department of Physics in Nanjing University, and Shanghai Institute of Ceramics of the Chinese Academy of Sciences. He has established a joint PhD program with the University of Sydney in Australia and a similar joint PhD program between City University of Hong Kong and Tsinghua University, China.

Prof. Chu is senior editor of IEEE Transactions on Plasma Science, associate editor of Materials Science and Engineering: Reports, and a member of the editorial board of Biomaterials, Surface and Coatings Technology, Surface and Interface Analysis, Recent Patents on Materials Science, Plasma Sources Science and Technology, International Journal of Molecular Engineering, and Cancer Technology: Basic, Translational, and Clinical Research.

Publications

Patents and Contracts

External links

References

  1. ^ New IEEE Fellows 2003, retrieved 1/24/07